2016年6月6日星期一

ir bga rework station WDS-750 ersa rework station bga for repair all bga xbox one motherboard

ir bga rework station WDS-750 ersa rework station bga for repair all bga xbox one motherboard

Skype: sales005-wisdomshow
Cell /WhatsApp: +86 13266540971
WDS-750
ir bga rework station

Features of WDS-750 ir bga rework station :

  • Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.   ir bga rework station
  • PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate
  • Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode [preheating,constant,warming,soldering, reflow soldering,cooling]
  • Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode [weld,remove,mount,manual],realize semi auto and auto function ,meet customer’s requirement   ir bga rework station
  • High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1℃
  • Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
  • Top heater and mounting heater design2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.zm-750
  • High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.  ir bga rework station
  • Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Technology Parameters of WDS-750 BGA Rework Station Supply :

Power
6800W
Up heater power
1200W
Down heater power
1200W
IR heater power
4200W(2400W control)
Power supply
(Single Phase)  AC 220V±10 50Hz
Position way
Optical lens+ Vshape holder+laser positioning
Temperature control
High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
Material
High sensitive touch screen+temperature control module+PLC+step drive
PCB Size
Max:500×450mm
PCB Size
Min: 10×10mm
Thermo-couple Ports
4pcs
Chips magnification times
2-30
PCB thickness
0.5-8mm
BGA size
0.8mm-8cm
Min.chips pitch
0.15mm
Mounting BGA weight
1000G
Mounting precision
±0.01mm
Size
L670×W780×H850mm
Optical alignment lens
Motor drive can move front back right left
Weight
About 90kg

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