ir bga rework station WDS-750 ersa rework station bga for repair all bga xbox one motherboard
Skype: sales005-wisdomshow
Cell /WhatsApp: +86 13266540971
Features of WDS-750 ir bga rework station :
- Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn. ir bga rework station
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- PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate
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- Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode [preheating,constant,warming,soldering, reflow soldering,cooling]
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- Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode [weld,remove,mount,manual],realize semi auto and auto function ,meet customer’s requirement ir bga rework station
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- High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1℃
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- Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
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- Top heater and mounting heater design2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.zm-750
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- High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result. ir bga rework station
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- Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )
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Technology Parameters of WDS-750 BGA Rework Station Supply :
Power
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6800W
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Up heater power
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1200W
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Down heater power
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1200W
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IR heater power
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4200W(2400W control)
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Power supply
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(Single Phase) AC 220V±10 50Hz
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Position way
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Optical lens+ Vshape holder+laser positioning
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Temperature control
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High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
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Material
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High sensitive touch screen+temperature control module+PLC+step drive
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PCB Size
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Max:500×450mm
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PCB Size
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Min: 10×10mm
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Thermo-couple Ports
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4pcs
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Chips magnification times
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2-30
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PCB thickness
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0.5-8mm
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BGA size
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0.8mm-8cm
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Min.chips pitch
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0.15mm
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Mounting BGA weight
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1000G
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Mounting precision
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±0.01mm
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Size
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L670×W780×H850mm
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Optical alignment lens
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Motor drive can move front back right left
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Weight
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About 90kg
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Welcome to Order now !!! Dear Waiting for you !!!
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